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Mohini Pendse

We have 4 records for Mohini Pendse ranging in age from 62 years old to 68 years old. Mohini has been found in 2 states including California and Virginia. On file we have 24 email addresses. And 7 phone numbers linked to Mohini, with area codes such as 302, 510, 530 and 610. The information below may also include images, social media accounts and more.

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Age

62

AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):

  • dattatraya r pendse
  • mohini r pendse
  • pendse r mohini
  • pendse r raj
  • pendse rajendra d
  • raj d pendse
  • raj r pendse
  • rajendra d pednse
  • rajendra dat pendse
  • rajendra dattatraya pendse
  • rajendra r pendse

Possible Relatives

Possible Associations

Possible User IDs

  • 6/26/a22@linkedin
  • 17969210@linkedin
  • #a220266@linkedin

Associated Phone Numbers

  • (510) 792-4051
  • (510) 676-8469
  • (510) 364-1914
  • (510) 449-3141
  • (510) 449-3140

Associated Email Addresses

  • xxxxxx@aol.com
  • xxxxxx@att.net
  • xxxxxx@hotmail.com
  • xxxxxx@swbell.net
  • xxxxxxx@address.com
  • xxxxxxx@aol.com
  • xxxxxxx@earthlink.net
  • xxxxxxx@fb.com
  • xxxxxxxx@hotmail.com
  • xxxxxxxxxx@fb.com
  • xxxxxxxxxx@statschippac.com
  • xxxxxxxxxxxx@comcast.net
  • xxxxxxxxxxxx@socal.rr.com

Last Known Phone Numbers

(510) 792-4051 (Primary Phone)

landline

pacific bell telephone company (at&t california)

(510) 676-8469

mobile

new cingular wireless pcs llc (at&t mobility)

Jobs

  • Facebook Architect Silicon Packaging, Facebook Reality Labs (frl) at Facebook (since 2018)
  • Qualcomm Snr Director/vice President, Package Architecture & Technology Development at Qualcomm (2015-2018)
  • Qualcomm Vice President/snr Director, Technology at Qualcomm (since 2015)
  • Qualcomm Vice President, Package Engineering at Qualcomm (since 2015)
  • Qualcomm Senior Director, Package Architecture & Technology Development at Qualcomm (since 2015)
  • Statschippac Vice President & Chief Marketing Officer at Statschippac (1999-2015)
  • Statschippac Vice President, Advanced Packaging at Statschippac (1999-2015)
  • Hewlett Packard Enterprise Packaging Technologist at Hewlett Packard Enterprise (1989-1999)
  • Hewlett-packard Labs Snr Pacakging Technologist at Hewlett-packard Labs (1989-1999)
  • Hewlett-packard Labs Manager of Pacakge Development at Hewlett-packard Labs (1989-1999)
  • National Semiconductor Snr Engineer/ Manager at National Semiconductor (1985-1989)
  • National Semiconductor Section Head at National Semiconductor (1985-1989)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2004-2004)
  • Stats Chippac, Inc. Stats Chippac, Inc. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2010-2010)
  • Facebook
  • Facebook
  • Qualcomm
  • Statschippac
  • Hewlett Packard Enterprise
  • National Semiconductor

Education

  • B.tech, Materials Science, First in Class from Indian Institute of Technology, Bombay
  • Phd, Materials Science from University of California, Berkeley

Last Known Address

5245 Diamond Cmn
Fremont, California 94555

Alameda

Past Addresses

Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Mohini Pendse.

  • 854 Fruitvale Ave
    Oakland, California 94601
  • 47400 Kato Rd
    Fremont, California 94538

Job History

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Facebook

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Stats Chippac, Inc.

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Stats Chippac, Ltd.

  • Mohini Pendse
    Director, Silicon Packaging, Facebook Reality Labs (frl)

    Facebook

  • Mohini Pendse
    Manager of Pacakge Development

    Hewlett-packard Labs

  • Mohini Pendse
    Packaging Technologist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Research Scientist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Section Head

    National Semiconductor

  • Mohini Pendse
    Senior Director, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Director/vice President, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Engineer/ Manager

    National Semiconductor

  • Mohini Pendse
    Snr Pacakging Technologist

    Hewlett-packard Labs

  • Mohini Pendse
    Vice President & Chief Marketing Officer

    Statschippac

  • Mohini Pendse
    Vice President/snr Director, Technology

    Qualcomm

  • Mohini Pendse
    Vice President, Advanced Packaging

    Statschippac

  • Mohini Pendse
    Vice President, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Vice President, Package Engineering

    Qualcomm

What Could You Find in a Background Report?

  • Possible Aliases
  • Possible Relatives
  • Associated Phone Numbers
  • Possible Last Known Phone Numbers
  • Possible User IDs
  • Approximate Age Range
  • Possible Educations
  • Associated Email Addresses
  • Possible Job History
  • Possible Past Addresses
  • Possible Jobs
  • Possible Last Known Address
  • Associated Addresses
  • Possible Asset History

SEARCH FOR BACKGROUND REPORTS

Age

62

AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):

  • mohini r pendse
  • pendse r mohini
  • pendse r raj
  • pendse rajendra d
  • raj d pendse
  • raj r pendse
  • rajendra d pednse
  • rajendra dat pendse
  • rajendra dattatraya pendse
  • rajendra r pendse

Possible Relatives

Possible Associations

Possible User IDs

  • 6/26/a22@linkedin
  • 17969210@linkedin
  • #a220266@linkedin

Associated Phone Numbers

  • (510) 792-4051
  • (510) 364-1914
  • (510) 676-8469
  • (510) 449-3140
  • (510) 449-3141

Associated Email Addresses

  • xxxxxx@adtasc.com
  • xxxxxx@aol.com
  • xxxxxx@att.net
  • xxxxxx@earthlink.net
  • xxxxxx@hotmail.com
  • xxxxxx@swbell.net
  • xxxxxxx@address.com
  • xxxxxxx@aol.com
  • xxxxxxx@earthlink.net
  • xxxxxxx@fb.com
  • xxxxxxx@gmail.com
  • xxxxxxx@qti.qualcomm.com
  • xxxxxxxx@hotmail.com
  • xxxxxxxxxx@fb.com
  • xxxxxxxxxx@statschippac.com
  • xxxxxxxxxxx@earthlink.net
  • xxxxxxxxxxxx@comcast.net
  • xxxxxxxxxxxx@socal.rr.com
  • xxxxxxxxxxxxx@gmail.com

Last Known Phone Numbers

(510) 792-4051 (Primary Phone)

landline

pacific bell telephone company (at&t california)

First Reported May 01, 1993

(510) 364-1914

mobile

new cingular wireless pcs llc (at&t mobility)

Jobs

  • Facebook Architect Silicon Packaging, Facebook Reality Labs (frl) at Facebook (since 2018)
  • Qualcomm Snr Director/vice President, Package Architecture & Technology Development at Qualcomm (2015-2018)
  • Qualcomm Vice President/snr Director, Technology at Qualcomm (since 2015)
  • Qualcomm Vice President, Package Engineering at Qualcomm (since 2015)
  • Qualcomm Senior Director, Package Architecture & Technology Development at Qualcomm (since 2015)
  • Statschippac Vice President & Chief Marketing Officer at Statschippac (1999-2015)
  • Statschippac Vice President, Advanced Packaging at Statschippac (1999-2015)
  • Hewlett Packard Enterprise Packaging Technologist at Hewlett Packard Enterprise (1989-1999)
  • Hewlett-packard Labs Snr Pacakging Technologist at Hewlett-packard Labs (1989-1999)
  • Hewlett-packard Labs Manager of Pacakge Development at Hewlett-packard Labs (1989-1999)
  • National Semiconductor Snr Engineer/ Manager at National Semiconductor (1985-1989)
  • National Semiconductor Section Head at National Semiconductor (1985-1989)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2004-2004)
  • Stats Chippac, Inc. Stats Chippac, Inc. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2010-2010)
  • Facebook
  • Facebook
  • Qualcomm
  • Statschippac
  • Hewlett Packard Enterprise
  • National Semiconductor

Education

  • B.tech, Materials Science, First in Class from Indian Institute of Technology, Bombay
  • Phd, Materials Science from University of California, Berkeley

Last Known Address

5245 Diamond Cmn
Fremont, California 94555

Alameda

Past Addresses

Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Mohini Pendse.

  • 107 S Mary Ave Apt 77
    Sunnyvale, California 94086
  • 854 Fruitvale Ave
    Oakland, California 94601
  • 47400 Kato Rd
    Fremont, California 94538

Job History

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Facebook

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Stats Chippac, Inc.

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Stats Chippac, Ltd.

  • Mohini Pendse
    Director, Silicon Packaging, Facebook Reality Labs (frl)

    Facebook

  • Mohini Pendse
    Manager of Pacakge Development

    Hewlett-packard Labs

  • Mohini Pendse
    Packaging Technologist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Research Scientist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Section Head

    National Semiconductor

  • Mohini Pendse
    Senior Director, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Director/vice President, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Engineer/ Manager

    National Semiconductor

  • Mohini Pendse
    Snr Pacakging Technologist

    Hewlett-packard Labs

  • Mohini Pendse
    Vice President & Chief Marketing Officer

    Statschippac

  • Mohini Pendse
    Vice President/snr Director, Technology

    Qualcomm

  • Mohini Pendse
    Vice President, Advanced Packaging

    Statschippac

  • Mohini Pendse
    Vice President, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Vice President, Package Engineering

    Qualcomm

Age

68

AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):

  • mohini dattatraya pendse
  • pendse dattatraya mohini
  • pendse dattatraya raj
  • pendse rajendra d
  • raj d pendse
  • rajendra d pednse
  • rajendra dat pendse
  • rajendra dattatraya pendse

Possible Relatives

Possible Associations

Possible User IDs

  • 6/26/a22@linkedin
  • 17969210@linkedin
  • #a220266@linkedin

Associated Phone Numbers

  • (510) 792-4051
  • (510) 847-7343
  • (530) 966-9084

Associated Email Addresses

  • xxxxxx@adesa.com
  • xxxxxx@aol.com
  • xxxxxx@att.net
  • xxxxxx@hotmail.com
  • xxxxxx@swbell.net
  • xxxxxxx@address.com
  • xxxxxxx@aol.com
  • xxxxxxx@earthlink.net
  • xxxxxxxx@address.com
  • xxxxxxxx@hotmail.com
  • xxxxxxxxxx@statschippac.com
  • xxxxxxxxxxxx@comcast.net
  • xxxxxxxxxxxx@socal.rr.com
  • xxxxxxxxxxxxxx@hotmail.com

Last Known Phone Numbers

(510) 792-4051 (Primary Phone)

activelandline

pacific bell telephone company (at&t california)

(510) 847-7343

mobile

cellco partnership dba verizon wireless - ca (verizon wireless)

Jobs

  • Facebook Architect Silicon Packaging, Facebook Reality Labs (frl) at Facebook (since 2018)
  • Qualcomm Snr Director/vice President, Package Architecture & Technology Development at Qualcomm (2015-2018)
  • Qualcomm Vice President/snr Director, Technology at Qualcomm (since 2015)
  • Qualcomm Vice President, Package Engineering at Qualcomm (since 2015)
  • Qualcomm Senior Director, Package Architecture & Technology Development at Qualcomm (since 2015)
  • Statschippac Vice President & Chief Marketing Officer at Statschippac (1999-2015)
  • Statschippac Vice President, Advanced Packaging at Statschippac (1999-2015)
  • Hewlett Packard Enterprise Packaging Technologist at Hewlett Packard Enterprise (1989-1999)
  • Hewlett-packard Labs Snr Pacakging Technologist at Hewlett-packard Labs (1989-1999)
  • Hewlett-packard Labs Manager of Pacakge Development at Hewlett-packard Labs (1989-1999)
  • National Semiconductor Snr Engineer/ Manager at National Semiconductor (1985-1989)
  • National Semiconductor Section Head at National Semiconductor (1985-1989)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2004-2004)
  • Stats Chippac, Inc. Stats Chippac, Inc. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2010-2010)

Education

  • B.tech, Materials Science, First in Class from Indian Institute of Technology, Bombay
  • Phd, Materials Science from University of California, Berkeley

Last Known Address

5245 Diamond Cmn
Fremont, California 94555

Alameda

Past Addresses

Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Mohini Pendse.

  • 854 Fruitvale Ave
    Oakland, California 94601
  • 47400 Kato Rd
    Fremont, California 94538
  • 5245 Diamond Cmn
    Fremont, California 94555

Job History

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Facebook

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Stats Chippac, Inc.

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Stats Chippac, Ltd.

  • Mohini Pendse
    Manager of Pacakge Development

    Hewlett-packard Labs

  • Mohini Pendse
    Packaging Technologist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Section Head

    National Semiconductor

  • Mohini Pendse
    Senior Director, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Director/vice President, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Engineer/ Manager

    National Semiconductor

  • Mohini Pendse
    Snr Pacakging Technologist

    Hewlett-packard Labs

  • Mohini Pendse
    Vice President & Chief Marketing Officer

    Statschippac

  • Mohini Pendse
    Vice President/snr Director, Technology

    Qualcomm

  • Mohini Pendse
    Vice President, Advanced Packaging

    Statschippac

  • Mohini Pendse
    Vice President, Package Engineering

    Qualcomm

Age

68

AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):

  • mohini r pendse
  • pendse r mohini
  • pendse r raj
  • pendse rajendra d
  • raj d pendse
  • raj r pendse
  • rajendra d pednse
  • rajendra d pendse
  • rajendra dat pendse
  • rajendra dattatraya pendse
  • rajendra r pednse
  • rajendra r pendse
  • rajesh r pendse

Possible Relatives

Possible Associations

Possible User IDs

  • 6/26/a22@linkedin
  • 17969210@linkedin
  • #a220266@linkedin

Associated Phone Numbers

  • (510) 792-4051
  • (510) 364-1914
  • (510) 449-3141
  • (510) 676-8469
  • (510) 847-7343
  • (530) 966-9084

Associated Email Addresses

  • xxxxxx@adesa.com
  • xxxxxx@adtasc.com
  • xxxxxx@aol.com
  • xxxxxx@att.net
  • xxxxxx@hotmail.com
  • xxxxxx@swbell.net
  • xxxxxxxx@address.com
  • xxxxxxxx@yahoo.com
  • xxxxxxxxxx@gmail.com
  • xxxxxxxxxxxx@comcast.net
  • xxxxxxxxxxxx@socal.rr.com
  • xxxxxxxxxxxxx@gmail.com
  • xxxxxxxxxxxxxx@hotmail.com

Last Known Phone Numbers

(510) 792-4051 (Primary Phone)

landline

pacific bell telephone company (at&t california)

First Reported November 13, 2000

(510) 364-1914

mobile

new cingular wireless pcs llc (at&t mobility)

Jobs

  • Facebook Architect Silicon Packaging, Facebook Reality Labs (frl) at Facebook (since 2018)
  • Qualcomm Snr Director/vice President, Package Architecture & Technology Development at Qualcomm (2015-2018)
  • Qualcomm Vice President/snr Director, Technology at Qualcomm (since 2015)
  • Qualcomm Vice President, Package Engineering at Qualcomm (since 2015)
  • Qualcomm Senior Director, Package Architecture & Technology Development at Qualcomm (since 2015)
  • Statschippac Vice President & Chief Marketing Officer at Statschippac (1999-2015)
  • Statschippac Vice President, Advanced Packaging at Statschippac (1999-2015)
  • Hewlett Packard Enterprise Packaging Technologist at Hewlett Packard Enterprise (1989-1999)
  • Hewlett-packard Labs Snr Pacakging Technologist at Hewlett-packard Labs (1989-1999)
  • Hewlett-packard Labs Manager of Pacakge Development at Hewlett-packard Labs (1989-1999)
  • National Semiconductor Snr Engineer/ Manager at National Semiconductor (1985-1989)
  • National Semiconductor Section Head at National Semiconductor (1985-1989)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2004-2004)
  • Stats Chippac, Inc. Stats Chippac, Inc. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2010-2010)
  • Citi
  • Facebook
  • Facebook
  • Qualcomm
  • Statschippac
  • Hewlett Packard Enterprise
  • National Semiconductor

Education

  • B.tech, Materials Science, First in Class from Indian Institute of Technology, Bombay
  • Phd, Materials Science from University of California, Berkeley

Last Known Address

5245 Diamond Cmn
Fremont, California 94555

Alameda

Past Addresses

Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Mohini Pendse.

  • 854 Fruitvale Ave
    Oakland, California 94601
  • 47400 Kato Rd
    Fremont, California 94538
  • 2521 Farmcrest Dr Apt 208
    Herndon, Virginia 20171
  • 5245 Diamond Cmn
    Fremont, California 94555

Job History

  • Mohini Pendse
    Apps Development Senior Manager

    Citi

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Facebook

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Stats Chippac, Inc.

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (frl)

    Stats Chippac, Ltd.

  • Mohini Pendse
    Director, Silicon Packaging, Facebook Reality Labs (frl)

    Facebook

  • Mohini Pendse
    Manager of Pacakge Development

    Hewlett-packard Labs

  • Mohini Pendse
    Packaging Technologist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Research Scientist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Section Head

    National Semiconductor

  • Mohini Pendse
    Senior Director, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Director/vice President, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Engineer/ Manager

    National Semiconductor

  • Mohini Pendse
    Snr Pacakging Technologist

    Hewlett-packard Labs

  • Mohini Pendse
    Vice President & Chief Marketing Officer

    Statschippac

  • Mohini Pendse
    Vice President/snr Director, Technology

    Qualcomm

  • Mohini Pendse
    Vice President, Advanced Packaging

    Statschippac

  • Mohini Pendse
    Vice President, Package Architecture & Technology Development

    Qualcomm

  • Mohini Pendse
    Vice President, Package Engineering

    Qualcomm

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Questions & Answers

How old is Mohini Pendse?

Mohini Pendse is possibly 62 years old and maybe was born in January 1964.

Where does Mohini Pendse live?

Mohini Pendse has been associated with 3 addresses, the last known one is 5245 Diamond Common, Fremont, Ca 94555.

What is Mohini Pendse’s phone number?

Mohini Pendse has been known to have 8 phone numbers, including (510) 792-4051.

What is Mohini Pendse’s email address?

Mohini Pendse has been known to have 28 email addresses, including xxxxxx@earthlink.net.

Who is Mohini Pendse related to?

Mohini Pendse's possible relatives include Mihir R Pendse, Rajendra Dattatraya Pendse.

What does Mohini Pendse do for a living?

Mohini Pendse could be an Architect Silicon Packaging, Facebook Reality Labs (frl) at Facebook and might have 21 other jobs on file.

Did Mohini Pendse go to school?

Mohini Pendse could of attended Indian Institute Of Technology, Bombay where Mohini Pendse received a degree in B.tech, Materials Science, First In Class.

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