How old is Rajendra Dat Pendse?
Rajendra Dat Pendse is possibly 62 years old and maybe was born in January 1964.
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We have 4 records for Rajendra Pendse ranging in age from 62 years old to 68 years old. Rajendra has been found in 2 states including California and Virginia. On file we have 24 email addresses. And 7 phone numbers linked to Rajendra, with area codes such as 302, 510, 530 and 610. The information below may also include images, social media accounts and more.
AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):
landline
pacific bell telephone company (at&t california)
mobile
new cingular wireless pcs llc (at&t mobility)
5245 Diamond Cmn
Fremont, California 94555
Alameda
Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Rajendra Pendse.
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Stats Chippac, Inc.
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Stats Chippac, Ltd.
Rajendra Pendse
Director, Silicon Packaging, Facebook Reality Labs (frl)
Rajendra Pendse
Manager of Pacakge Development
Hewlett-packard Labs
Rajendra Pendse
Packaging Technologist
Hewlett Packard Enterprise
Rajendra Pendse
Research Scientist
Hewlett Packard Enterprise
Rajendra Pendse
Section Head
National Semiconductor
Rajendra Pendse
Senior Director, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Snr Director/vice President, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Snr Engineer/ Manager
National Semiconductor
Rajendra Pendse
Snr Pacakging Technologist
Hewlett-packard Labs
Rajendra Pendse
Vice President & Chief Marketing Officer
Statschippac
Rajendra Pendse
Vice President/snr Director, Technology
Qualcomm
Rajendra Pendse
Vice President, Advanced Packaging
Statschippac
Rajendra Pendse
Vice President, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Vice President, Package Engineering
Qualcomm
AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):
landline
pacific bell telephone company (at&t california)
First Reported May 01, 1993
mobile
new cingular wireless pcs llc (at&t mobility)
5245 Diamond Cmn
Fremont, California 94555
Alameda
Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Rajendra Pendse.
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Stats Chippac, Inc.
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Stats Chippac, Ltd.
Rajendra Pendse
Director, Silicon Packaging, Facebook Reality Labs (frl)
Rajendra Pendse
Manager of Pacakge Development
Hewlett-packard Labs
Rajendra Pendse
Packaging Technologist
Hewlett Packard Enterprise
Rajendra Pendse
Research Scientist
Hewlett Packard Enterprise
Rajendra Pendse
Section Head
National Semiconductor
Rajendra Pendse
Senior Director, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Snr Director/vice President, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Snr Engineer/ Manager
National Semiconductor
Rajendra Pendse
Snr Pacakging Technologist
Hewlett-packard Labs
Rajendra Pendse
Vice President & Chief Marketing Officer
Statschippac
Rajendra Pendse
Vice President/snr Director, Technology
Qualcomm
Rajendra Pendse
Vice President, Advanced Packaging
Statschippac
Rajendra Pendse
Vice President, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Vice President, Package Engineering
Qualcomm
AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):
activelandline
pacific bell telephone company (at&t california)
mobile
cellco partnership dba verizon wireless - ca (verizon wireless)
5245 Diamond Cmn
Fremont, California 94555
Alameda
Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Rajendra Pendse.
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Stats Chippac, Inc.
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Stats Chippac, Ltd.
Rajendra Pendse
Manager of Pacakge Development
Hewlett-packard Labs
Rajendra Pendse
Packaging Technologist
Hewlett Packard Enterprise
Rajendra Pendse
Section Head
National Semiconductor
Rajendra Pendse
Senior Director, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Snr Director/vice President, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Snr Engineer/ Manager
National Semiconductor
Rajendra Pendse
Snr Pacakging Technologist
Hewlett-packard Labs
Rajendra Pendse
Vice President & Chief Marketing Officer
Statschippac
Rajendra Pendse
Vice President/snr Director, Technology
Qualcomm
Rajendra Pendse
Vice President, Advanced Packaging
Statschippac
Rajendra Pendse
Vice President, Package Engineering
Qualcomm
AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):
landline
pacific bell telephone company (at&t california)
First Reported November 13, 2000
mobile
new cingular wireless pcs llc (at&t mobility)
5245 Diamond Cmn
Fremont, California 94555
Alameda
Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Rajendra Pendse.
Rajendra Pendse
Apps Development Senior Manager
Citi
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Stats Chippac, Inc.
Rajendra Pendse
Architect Silicon Packaging, Facebook Reality Labs (frl)
Stats Chippac, Ltd.
Rajendra Pendse
Director, Silicon Packaging, Facebook Reality Labs (frl)
Rajendra Pendse
Manager of Pacakge Development
Hewlett-packard Labs
Rajendra Pendse
Packaging Technologist
Hewlett Packard Enterprise
Rajendra Pendse
Research Scientist
Hewlett Packard Enterprise
Rajendra Pendse
Section Head
National Semiconductor
Rajendra Pendse
Senior Director, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Snr Director/vice President, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Snr Engineer/ Manager
National Semiconductor
Rajendra Pendse
Snr Pacakging Technologist
Hewlett-packard Labs
Rajendra Pendse
Vice President & Chief Marketing Officer
Statschippac
Rajendra Pendse
Vice President/snr Director, Technology
Qualcomm
Rajendra Pendse
Vice President, Advanced Packaging
Statschippac
Rajendra Pendse
Vice President, Package Architecture & Technology Development
Qualcomm
Rajendra Pendse
Vice President, Package Engineering
Qualcomm
Click here to search for background reports.
Rajendra Dat Pendse is possibly 62 years old and maybe was born in January 1964.
Rajendra Dat Pendse has been associated with 3 addresses, the last known one is 5245 Diamond Common, Fremont, Ca 94555.
Rajendra Dat Pendse has been known to have 8 phone numbers, including (510) 792-4051.
Rajendra Dat Pendse has been known to have 28 email addresses, including xxxxxx@earthlink.net.
Rajendra Dat Pendse's possible relatives include Mihir R Pendse.
Rajendra Dat Pendse could be an Architect Silicon Packaging, Facebook Reality Labs (frl) at Facebook and might have 21 other jobs on file.
Rajendra Dat Pendse could of attended Indian Institute Of Technology, Bombay where Rajendra Dat Pendse received a degree in B.tech, Materials Science, First In Class.
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